MIL is a compact, table top machine for wafer inspection
It is designed to be a macro and back inspection tool, and to act as a microscope loader for a complete wafer inspection.
The tool is equipped with the most updated handling systems ad features laser mapping, recipe selection.
This equipment have been designed to fulfill the needs of short cycle times as well as the increasing difficulties due to thin or special wafers handling.
Such needs required a careful design, based on the state of the art technological solutions for both mechanics and control system.
MIL features micro and macro inspection capabilities, including a backside inspection with the full view of wafer bottom based on a contactless Bernoulli unit.
Wafer centering and alignment are performed through optical measurement systems, allowing to increase process speed and reducing unnecessary contact with wafer edges.
A very intuitive and easy to use GUI is implemented to allow the operator to access any function in the safest possible way with the aim to reduce at the minimum the risks for wafers due to handling errors.
Cassette mapping is performed through a sophisticated system which allows to reduce at the minimum the need of special setup for the majority of wafers. System teaching is simplified and almost automatic, implementing our autorecipe tool, which makes possible to define a new cassette profile with a simple guided operation and without the need of complex operations.
Once done autorecipe, the loader will be able to handle wafers of any thickness from 200μm to 1000μm, by automatically adapting the pickup levels to the real wafer positions as measured by mapping laser.
Its software includes recipe management to easily switch between different handling configurations like thickness and bow or warpage; it detects automatically wafer size.
To increase the productivity, it features different wafer selection methods to cover any inspection need.