UV/Ozone cleaning system is a tool designed for cleaning and curing of any kind of surface, and in particular for wafers to be decontaminated by organic residues before wire bonding.
Wafers can also be cured by UV-Ozone to remove resist residues or to enhance oxide thickness in epitaxy.
Ozone oxidates residues on part surface, and UV/C irradiation will produce a surface curing and decontamination.
To prepare surfaces for wire bonding, such as in COB processes, where plastic parts have to be assembled together with special glues or resins, like in packaging technology, to remove resist residues from wafers or when a metal part have to be cleaned and decontaminated from organic residues without aggressive chemicals or mechanical actions, Proteus UV/Ozone cleaner can be the right solution.
UV is a cost effective alternative to plasma etching, since it is not required any special vacuum chamber, nor gases or special facilities.
UV-Ozone cleaning can also be arranged to make cleaning lines with continuous loading, and can be coupled to a DI water rinse system to completely remove particles from surfaces.
The benchtop version is equipped with high pressure, high frequency UV tubes, with electronic ballasts and a motorized platform to drive parts into the cleaning chamber.
Safety sensors will avoid ozone environment contamination and UV exposition to the operator.
Control interface is extremely simple and user friendly, not requiring any special training for operators.